| PART |
Description |
Maker |
| HES301G400U3C HES301G450V3C HES302G400W5L HES312G3 |
Type HES 105 ìC High Energy Screw Terminal Aluminum Electrolytic
Type HES 105 oC High Energy Screw Terminal Aluminum Electrolytic
|
Cornell Dubilier Electr...
Cornell Dubilier Electronics
http://
|
| CD138PC |
EC Screw 85∑C Long Lifetime 10.000h High Reliability at High Voltage Highest Currents(Screw)
|
JIANGHAI[Jianghai Europe GmbH]
|
| EKMQ3B1LGB102MA80M EKMQ451LGB561MA80M EKMQ401LGC82 |
Standard screw terminals, 105?
Standard screw terminals, 105?
|
United Chemi-Con, Inc.
|
| PUMA68S4000/I-45 PUMA68S4000/M-45 PUMA68S4000/AI-3 |
24MHZ, TQFP, IND TEMP, GREEN(MCU 5X)
33MHZ, PLCC, COM TEMP(MCU 5X)
8051 32K FLASH 4 TO 5.5V,PDIP,GREEN(MCU 5X)
24MHZ, PDIP, IND TEMP(MCU 5X)
x32 SRAM Module
20MHZ, TSSOP, IND TEMP, 2.4-5.5V(MCU 5X)
24MHZ, TQFP, COM TEMP(MCU 5X) X32号的SRAM模块
|
L-com, Inc.
|
| EC2-12ND EC2-12SND EC2-24ND EC2-24SND EC2-3ND EC2- |
High Insulation, High breakdown voltage, compact and lightweight, Surface mounting type 高绝缘，高击穿电压，结构紧凑，重量轻，表面安装型
Driver IC; Package/Case:24-SSOP; Supply Voltage Max:5.25V; Leaded Process Compatible:No; Operating Temp. Max:70 C; Operating Temp. Min:-10 C; Peak Reflow Compatible (260 C):No; Frequency:20GHz; Interface Type:Serial
|
TE Connectivity, Ltd.
NEC, Corp.
NEC Corp.
|
| CD261LK |
EC 105∑C Long Lifetime 10.000 - 12.000h High Reliability at High Voltage(Radial)
|
JIANGHAI[Jianghai Europe GmbH]
|
| AD9216BCPZRL7-105 AD9216BCPZRL7-65 AD9216BCPZRL7-8 |
10-Bit, 65/80/105 MSPS Dual A/D Converter 2-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, QCC64
10-Bit, 65/80/105 MSPS Dual A/D Converter 10位，65/80/105 MSPS双通道的A / D转换
|
Analog Devices, Inc.
|
| AM29LV800BB-120WBI AM29LV800BB-120WBC AM29LV800BB- |
30MHZ, 3.3V, 44 TQFP, IND TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, IND TEMP(FPGA)
8-TSSOP,AUTO,Pb/HALO FREE,NIPDAU LF 2.5V(SERIAL EE)
10MHZ, 20 SOIC, COM TEMP, 5K MOQ(FPGA)
10MHZ, 20 SOIC, IND TEMP, 5K MOQ(FPGA)
30MHZ, 3.3V, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 44 TQFP, COM TEMP(FPGA)
30MHZ, 8 LAP, IND TEMP, GREEN(FPGA) x8/x16闪存EEPROM
x8/x16 Flash EEPROM x8/x16闪存EEPROM
32M CONFIG FLASH, 44 PLCC, GREEN(FPGA) x8/x16闪存EEPROM
512K X 16 FLASH 3V PROM, 120 ns, PDSO44
512K X 16 FLASH 3V PROM, 120 ns, PDSO48
10MHZ, 8 PDIP, COM TEMP, 5K MOQ(FPGA)
|
Analog Devices, Inc.
ADVANCED MICRO DEVICES INC
|
| AM3064-70/BZC AM3064-50GI175 AM3064-50JC068 AM3090 |
10MS, 8 EIAJ SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
10MS, 8 SOIC, IND TEMP, GREEN, 2.7V(BIOS FLASH)
DIE SALE, 2.7V, 7 MIL(BIOS FLASH)
10MS, 8 SAP, IND, ROHS-B, 2.7V(BIOS FLASH)
8-SOIC,AUTO TEMP,2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, 2.7V(SERIAL EE)
10MS, 8 PDIP, EXT TEMP, GREEN,2.7V(SERIAL EE)
10MS, 8 TSSOP, INT TEMP, GREEN, 1.8V(SERIAL EE)
10MS, 8 PDIP, INT TEMP, GREEN, 2.7V(SERIAL EE)
10MS, DIE 1.8V, 11 MILS THICKNESS(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN, 2.7V(SERIAL EE)
10MS, 8 PDIP, IND TEMP, GREEN,2.7V(SERIAL EE)
8 ULTRA THIN,MINI MAP,PB/HALO FREE,IND T(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 SOIC, EXT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
Field Programmable Gate Array (FPGA) 现场可编程门阵列（FPGA
10MS, 8 SOIC, INT TEMP, GREEN, 2.7V(SERIAL EE) 现场可编程门阵列（FPGA
10MS, 8 PDIP, EXT TEMP, GREEN, 2.7V(SERIAL EE)
|
Stackpole Electronics, Inc.
Ecliptek, Corp.
Analog Devices, Inc.
Glenair, Inc.
|
| ATF22V10C10 ATF22V10C-10GM_883 ATF22V10C-15GM_883 |
High-performance Electrically Erasable Programmable Logic Device
5NS, PLCC, COM TEMP, GREEN(EPLD) FLASH PLD, 5 ns, PQCC28
15NS, PDIP, IND TEMP, GREEN(EPLD) FLASH PLD, 15 ns, PDIP24
|
ATMEL Corporation
聚兴科技股份有限公司
Atmel, Corp.
|
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